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LJ-UHV PLD-400 System |
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LJ Ultra High Vacuum Pulsed Laser Deposition System |
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System includes |
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| 1 |
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Chambers |
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| 1_1 |
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Process chamber (UHV grade) |
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Diameter 400 mm |
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Electro polished SUS304 spherical chamber . |
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Multiple Conflate flange ports for user accessories including Load-lock chamber, RGA, Ion gun, sputter source, RHEED. and substrate view ports. |
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| 1_2 |
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Substrate Load/unload Load-lock chamber and Pneumatic valve |
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Diameter 230mm |
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Electro polished SUS304 spherical chamber |
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Multiple Conflate flange ports for user accessories including 6" access door, transportation rod, vacuum gauge and exhaust port. |
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| 1_3 |
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Target Change Load-lock chamber and Pneumatic valve |
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Diameter 110mm |
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Electro polished SUS304 spherical chamber |
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Multiple Conflate flange ports for user accessories including 4" access door, Transportation rod, vacuum gauge and exhaust port. |
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The Load-lock chamber will include the following components and modifications to the main chamber. A Viton O-ring will be added the the main door, the main chamber gate valve will utilize a metal seal bonnet. The substrate holder will be mounted to a motorized Z-stage with 2-inch stroke. a single wafer loadlock chamber with gate valve will be provided. the loadlock will have a quick access door for sample transfer along with a magnetically coupled linear transport rod to insert the substrate holder into the main chamber. The loadlock will include a roughing valve, and a 70 L/sec turbo pump with its own gate valve. the main chamber's (scroll) pump will back the loadlock turbo pump using proper valves,. vacuum gauging will include an ion gauge and Convectron gauge. Loadlock vent and over pressure relief valves will be provided. using the load lock the main chamber base pressure will be guaranteed to be below 5 x 10 -8 Torr. |
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| 2 |
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Vacuum pumping system: |
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Operating Pressure Range: 5 x 10-8 base to 500mTorr |
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| 2_1 |
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Dry pump for process chamber |
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Pumping speed: 850L/min |
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| 2_2 |
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Turbo pump for process chamber |
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Pumping speed: 500 L/sec |
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| 2_3 |
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Turbo pump for Substrate Load/Unload Load-lock chamber and Target Change Load-lock chamber |
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Pumping speed: 70 L/sec |
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| 3 |
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Vacuum Gauges |
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| 3_1 |
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Low vacuum gauge |
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Pirani Gauge |
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Spec: 750 Torr ~ 3.75x10-4 Torr |
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| 3_2 |
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High vacuum gauge |
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Hot Ion Gauge |
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Spec: 750 Torr ~ 1x10-9 Torr |
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Three (3) guages fir Process chamber , Substrate Load-lock chamber and Target change Load-lock chamber. |
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| 3_3 |
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Process gauge |
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Capacitance gauge |
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Spec: 1 Torr (MKS Baratron 626A or Equal) |
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| 4 |
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Mass Flow Controller and Auto Pressure Control |
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| 4_1 |
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MFC |
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| 4_1 |
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MFC |
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Mass Flow Controller and 1/4" VCR Pneumatic valve |
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Ar 50 sccm: 1 sets |
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O2 50 sccm: 1 sets |
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| 4_2 |
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APC |
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Closed Lopp Pressure Control and Pneumatic Valve Package Auto pressure control |
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Control valve 8" Electro control |
