Sputtering Cathode
- ．φ3 Magnetron Sputtering Cathode
- ．Rectangular Magnetron Cathode
- ．φ4 Magnetron Sputtering Cathode
- ．φ2 Magnetron Sputtering Cathode
- ．Flex Mount Sputter Cathode
- Magnetron Sputtering Cathode Specification:
Specifications
Sputtering Gun
Target size
2inches diameter
Target thickness
Less than
6.35mm Mounting
3/
4” Quick coupler May be mounted in top of chamber, in the baseplate, or in a feedthrough collar. Gun will operate in any orientation Power Required
Maximum 1000 watts, 13.56Mhz RF or maximum 2000 watts DC.
Shutter function
Included
Preventing impurity material sputtering on the wafer surface
Cathode Voltage
200 – 1500 volts
Cooling Method
indirect
Cooling Water
0.3 GPM
Cooling Water Resistivity
RF 5 MΩ, Minimum
DC 3 MΩ, Minimum
Target Geometry
Circular disk
Target Mounting
Screw
Overall High
200 mm Largest diameter
95 mm Normal operating pressure
1 - 400 mTtorr
Vacuum
Range
1x10-8 Torr
Leak Test
2×10-10 cc/sec of He
Cooling Water
Flow Rate
0.2 to
0.5 gal/min Temperature
18℃ to 32℃ Pressure
30 to 40 PSI
備註 》Shutter function is optional
